发明名称 Heat-decaying materials, transfer sheet using the same, and patterning method
摘要 Provided is a heat-decaying material that hardly deteriorates and decomposed at ordinary service temperatures, but decays within a short period of time when heated at relatively low temperatures. This comprises a polyoxyalkylene resin as the principal ingredient thereof, and has an oxygen atom content of from 15 to 55% by mass. When heated at a predetermined temperature falling between 150 and 350° C., at least 95% by mass of the material decays within 10 minutes. The heat-decaying material has many applications for production of porous materials, conductive particles transfer sheets, transfer sheets for circuit formation, pattern formation, etc.
申请公布号 US7591921(B2) 申请公布日期 2009.09.22
申请号 US20050532747 申请日期 2005.04.26
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 FUKUI HIROJI;ENAMI TOSHIO
分类号 B29C63/00;B32B7/02;B41M5/00;B44C1/17;C08G65/329;C08G65/336;C08J11/06;C08K3/22;C08K5/14;C08K5/17;C08K5/23;C08K5/37;C08L71/02;C09J7/02;C09J11/00;C09J171/00;G03G7/00;H01B5/14;H01L21/60;H01L21/68;H01L21/768;H05K1/03;H05K3/04;H05K3/20;H05K3/34 主分类号 B29C63/00
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