发明名称 |
Heat-decaying materials, transfer sheet using the same, and patterning method |
摘要 |
Provided is a heat-decaying material that hardly deteriorates and decomposed at ordinary service temperatures, but decays within a short period of time when heated at relatively low temperatures. This comprises a polyoxyalkylene resin as the principal ingredient thereof, and has an oxygen atom content of from 15 to 55% by mass. When heated at a predetermined temperature falling between 150 and 350° C., at least 95% by mass of the material decays within 10 minutes. The heat-decaying material has many applications for production of porous materials, conductive particles transfer sheets, transfer sheets for circuit formation, pattern formation, etc.
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申请公布号 |
US7591921(B2) |
申请公布日期 |
2009.09.22 |
申请号 |
US20050532747 |
申请日期 |
2005.04.26 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
FUKUI HIROJI;ENAMI TOSHIO |
分类号 |
B29C63/00;B32B7/02;B41M5/00;B44C1/17;C08G65/329;C08G65/336;C08J11/06;C08K3/22;C08K5/14;C08K5/17;C08K5/23;C08K5/37;C08L71/02;C09J7/02;C09J11/00;C09J171/00;G03G7/00;H01B5/14;H01L21/60;H01L21/68;H01L21/768;H05K1/03;H05K3/04;H05K3/20;H05K3/34 |
主分类号 |
B29C63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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