发明名称 Device and methodology for reducing effective dielectric constant in semiconductor devices
摘要 Semiconductor structure includes an insulator layer having at least one interconnect feature and at least one gap formed in the insulator layer spanning more than a minimum spacing of interconnects.
申请公布号 US7592685(B2) 申请公布日期 2009.09.22
申请号 US20070849048 申请日期 2007.08.31
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 EDELSTEIN DANIEL C.;COLBURN MATTHEW E.;COONEY, III EDWARD C.;DALTON TIMOTHY J.;FITZSIMMONS JOHN A.;GAMBINO JEFFREY P.;HUANG ELBERT E.;LANE MICHAEL W.;MCGAHAY VINCENT J.;NICHOLSON LEE M.;NITTA SATYANARAYANA V.;PURUSHOTHAMAN SAMPATH;SANKARAN SUJATHA;SHAW THOMAS M.;SIMON ANDREW H.;STAMPER ANTHONY K.
分类号 H01L29/93;H01L21/033;H01L21/302;H01L21/311;H01L21/4763;H01L21/768;H01L23/48;H01L23/522;H01L23/532;H01L29/40 主分类号 H01L29/93
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