BUMP AND BUMP CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a bump capable of being printed on an electrode and preventing remelting under a reflow heat treatment condition while being capable of preventing a short circuit caused by collapse upon connection. SOLUTION: The bump is constituted of a solder alloy which is not remelted at a reflow temperature and has a plurality of holes on at least connecting surface upon mounting and its proportion of holes computed by dividing the total area of holes in the section of the bump by the total bump area and multiplying the result by 100 is 5%-80%. COPYRIGHT: (C)2009,JPO&INPIT