发明名称 SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of preventing degradation of a withstand voltage of a gate insulation film of a peripheral transistor, in relation to a logic semiconductor device with a nonvolatile memory mixedly mounted thereon. SOLUTION: This manufacturing method of a semiconductor device includes processes of: forming an element separation region defining an active region on a semiconductor substrate; forming a first insulation film; forming a second insulation film having an etching characteristic different from that of the first insulation film; removing the second insulation film formed in a region including at least a boundary between the active region and the element separation region by dry etching using a fluorocarbon-based etching gas; removing a fluorocarbon film adhering to a surface of the first insulation film in the dry etching by exposing it to an atmosphere containing oxygen; and removing the first insulation film by wet etching. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009200340(A) 申请公布日期 2009.09.03
申请号 JP20080041782 申请日期 2008.02.22
申请人 FUJITSU MICROELECTRONICS LTD 发明人 OGURA HISANORI;OGURA TERU;KOJIMA HIDEYUKI;ANEZAKI TORU;OGAWA HIROYUKI;ARIYOSHI JUNICHI
分类号 H01L21/8247;H01L21/76;H01L27/10;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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