| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component which hardly falls from a circuit substrate while relaxing stress to an element. SOLUTION: The mounting structure 1 of an electronic component is equipped with a laminated layer type capacitor 2 and a circuit substrate 3. The laminated layer type capacitor 2 has a dielectric element 10 containing sides 10a-10d and external electrodes 12A, 12B. The circuit substrate 3 has signal electrodes 4A, 4B. The external electrodes 12A, 12B include baked electrode layers 16A, 16B and resin electrode layers 18A, 18B, respectively. The resin electrode layer 18A has an extending portion EA which does not lap on the baked electrode 16A when seen from a side 10c. The length L of the extending portion EA is longer than the length L1 of a part positioned on the side 10c in the baked electrode 16A, and the extending portion EA and the side 10c are not in contact with each other. The baked electrode layer 16A and a first plated layer 20A are connected with each other on the side 10a of the dielectric element 10 through the resin electrode layer 18A. COPYRIGHT: (C)2009,JPO&INPIT
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