| 发明名称 |
ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME |
| 摘要 |
The present invention relates to an adhesive tape for electrically connecting semiconductor chips in a chip-on-chip type semiconductor device. The adhesive tape comprising: (A) 10 to 50 wt% of film forming resin; (B) 30 to 80 wt% of curable resin; and (C) 1 to 20 wt% of curing agent having flux activity. |
| 申请公布号 |
EP2096671(A1) |
申请公布日期 |
2009.09.02 |
| 申请号 |
EP20070831187 |
申请日期 |
2007.10.30 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
KATSURAYAMA, SATORU;YAMASHIRO, TOMOE;HIRANO, TAKASHI |
| 分类号 |
H01L25/065;C09J7/00;C09J133/00;C09J163/00;C09J171/10;C09J179/08;H01L25/07;H01L25/18 |
主分类号 |
H01L25/065 |
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