| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure method capable of performing projection exposure by positioning a reticle and a photosensitive substrate through alignment of a reverse-surface mark and a reticle mark. <P>SOLUTION: The projection exposure device is configured to perform projection exposure of a pattern on the reticle R onto the substrate through a projection optical system 17 by measuring a position of the reverse-surface mark provided on a reverse surface of the photosensitive substrate. In the projection exposure device, a first reference mark FM1 is provided at a position conjugate to the reticle mark RM provided on the reticle, a first measuring sensor for measuring them are disposed, further, a second reference mark FM2 is provided at a position conjugate to the reverse-surface mark, a second measuring sensor for measuring them are disposed, and the first reference mark and second reference mark are disposed at a distance corresponding to the thickness of the photosensitive substrate on a substrate stage. <P>COPYRIGHT: (C)2011,JPO&INPIT |
