发明名称 INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE DIES AND INTERRUPT PROCESSING
摘要 A package includes a first die and a second die. The dies are connected to each other through an interface. The package includes interrupt processing for detecting interrupt information and providing a packet in response to the interrupt information detection. The packet includes an address to which data in the packet is to be written. The interface is configured to transport the packet between the dies. A data store is provided to which the data is writable. An interrupt event is determined from data received in several packets.
申请公布号 US2011138093(A1) 申请公布日期 2011.06.09
申请号 US20100960713 申请日期 2010.12.06
申请人 STMICROELECTRONICS (R&D) LTD 发明人 JONES ANDREW MICHAEL;RYAN STUART
分类号 G06F13/24;G06F12/00 主分类号 G06F13/24
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