| 摘要 |
Methods of forming a conductive via may include forming a blind via hole partially through a substrate, forming an aluminum film on surfaces of the substrate, removing a first portion of the aluminum film from some surfaces, selectively depositing conductive material onto a second portion of the aluminum film, and exposing the blind via hole through a back side of the substrate. Methods of fabricating a conductive via may include forming at least one via hole through at least one unplated bond pad, forming a first adhesive over at least one surface of the at least one via hole, forming a dielectric over the first adhesive, forming a base layer over the dielectric and the at least one unplated bond pad, and plating nickel onto the base layer. |
