COPPER ALLOY SHEET AND PROCESS FOR PRODUCING SAME

摘要

Provided is a copper alloy sheet which has excellent bendability and excellent strength and is suitable for use in lead frames, connectors, and terminal materials for electric/electronic appliances, connectors or terminal materials for vehicular mounting, relays, switches, and the like. Also provided is a process for producing the copper alloy sheet. The copper alloy sheet, when analyzed for crystal orientation by EBSD (electron back scatter diffraction), has a value of R defined by the equation of 1 or greater: R=([BR]+[RDW]+[W])/([C]+[S]+[B]) where [BR], [RDW], [W], [C], [S], and [B] respectively are the areal proportions of texture components respectively having BR orientation {362}<853>, RD-rotated-cube orientation {012}<100>, cube orientation {100}<001>, copper orientation {121}<111>, S orientation {231}<346>, and brass orientation {110}<112>. The sheet has a proof strength of 500 MPa or greater and a conductivity of 30% IACS or higher.