发明名称 |
LAMINAT FÜR FLEXIBLE LEITERPLATTEN |
摘要 |
<p>To provide a laminate for a flexible printed wiring board excellent in signal response in the high frequency region. A laminate for a flexible printed wiring board having a three-layer laminated structure where a reinforcing layer (A), an electrical insulator layer (B) and an electrical conductor layer (C) are laminated in this order, wherein the electrical insulator layer (B) is made of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and the electrical conductor layer (C) has a surface roughness of at most 10 µm on the side being in contact with the electrical insulator layer (B). The laminate for a flexible printed wiring board is excellent in signal response in the high frequency region and excellent in flex resistance.</p> |
申请公布号 |
DE602005027743(D1) |
申请公布日期 |
2011.06.09 |
申请号 |
DE20056027743T |
申请日期 |
2005.12.07 |
申请人 |
ASAHI GLASS CO. LTD. |
发明人 |
IWASA, TSUYOSHI;FUNAKI, ATSUSHI;HIGUCHI, YOSHIAKI |
分类号 |
H05K1/03;B32B15/082;C08F214/18 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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