| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component where a crack and a chip are hardly generated in a wiring board at dicing so that the manufacturing of a high non-defective yield becomes possible. <P>SOLUTION: The electronic component 1 includes a rectangular wiring board 10 and an electronic component element 20 mounted to the wiring board 10. The wiring board 10 includes a board body 11, a wiring 14 formed on the board body 11 and a terminal electrode 15. The board body 11 is provided by impregnating fiber crosses 12a-12c comprising a plurality of fibers with a resin composition 13. The wiring board 10 further includes a resin film 30 formed on the board body 11. The resin film 30 is not formed in a part of the end edge of the wiring board 10. The resin film 30 has: a first part 30a so formed as to isolate the part where a terminal electrode 15 is provided from the other part; and a second part 30b formed at a corner of the wiring board 10. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
