| 摘要 |
PROBLEM TO BE SOLVED: To reduce a deflection that occurs on a junction substrate. SOLUTION: The bonding method includes step S2 in which a first substrate surface of a first substrate and a second substrate surface of a second substrate are irradiated with particles to activate the second substrate surface and the first substrate surface, step S3 in which a difference between the temperature of the first substrate and the temperature of the second substrate is decreased, and step S4 in which, after the temperature difference becomes smaller than a predetermined temperature difference, the second substrate surface is made to contact to the first substrate surface so that the second substrate is bonded to the first substrate. By this bonding method, the deflection which is caused by thermal expansion of the second substrate and the first substrate can be reduced more than in the case of other junction substrate which is bonded before a temperature difference becomes smaller than a predetermined temperature difference. COPYRIGHT: (C)2011,JPO&INPIT |
