发明名称 SOLID-STATE IMAGING APPARATUS AND PACKAGE FOR SOLID-STATE IMAGING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus that can reduce an influence ofαrays emitted from a cover glass and enables the manufacturing cost thereof to be reduced, and to provide a package for the solid-state imaging apparatus. SOLUTION: A solid-state imaging device 10 is mounted on a recess 41 of a package portion 40. The cover glass 20 is provided on a light reception surface side of the solid-state imaging device 10 to close an opening of the recess 41. Anα-ray blocking film 30 is provided on a surface of the cover glass 20 on the side of the solid-state imaging device 10. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011114266(A) 申请公布日期 2011.06.09
申请号 JP20090271404 申请日期 2009.11.30
申请人 NIKON CORP 发明人 OKOCHI NAOKI
分类号 H01L27/14;H01L23/02;H04N5/335 主分类号 H01L27/14
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