摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus that can reduce an influence ofαrays emitted from a cover glass and enables the manufacturing cost thereof to be reduced, and to provide a package for the solid-state imaging apparatus. SOLUTION: A solid-state imaging device 10 is mounted on a recess 41 of a package portion 40. The cover glass 20 is provided on a light reception surface side of the solid-state imaging device 10 to close an opening of the recess 41. Anα-ray blocking film 30 is provided on a surface of the cover glass 20 on the side of the solid-state imaging device 10. COPYRIGHT: (C)2011,JPO&INPIT |