| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of dividing a laminated wafer, in which the laminated wafer can be divided without being broken. SOLUTION: The method of dividing the laminated wafer formed by laminating a plurality of wafers includes: a step of irradiating the wafers to be laminated with a laser beam having a wavelength with permeability into the wafers, along predetermined division lines of the wafer, to form altered layers along the predetermined division lines in the respective wafers; a step of positioning and laminating the respective wafers so that the altered layers of the respective wafers are aligned; and a step of applying external force to the laminated wafers to divide them into individual chips. COPYRIGHT: (C)2011,JPO&INPIT |
