| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal analysis device using a MEMS-based sensor advantageous for the analysis of small samples or extreme thermal processes. SOLUTION: The thermal analysis device includes a replaceable sensor 19, that can be contacted via a contact element 23 of electrical contacting means, a heating element 14, and a cooling element 20. The contact element(s) 23 is thermally connected to the heating element 14 and can be heated, independently of the operating state of the cooling element 20, even when a sensor 19 is not mounted in the device. COPYRIGHT: (C)2011,JPO&INPIT |
