发明名称 Method for predicting the polishing characteristics and life-span of a soft polishing pad
摘要 A method for predicting the polishing characteristics and life-span of a soft polishing pad includes the steps of: (a) establishing a matching database by means of performing a series of dynamic analysis tests on a new soft polishing pad by a contact probe at different frequencies and under different loads and detecting the surface reaction of the new soft polishing pad, (b) performing a dynamic analysis test on a to-be-tested soft polishing pad by a contact probe at a predetermined frequency and under a predetermined load and detecting the surface reaction of the to-be-tested soft polishing pad, and (c) comparing the surface reaction data of the to-be-tested soft polishing pad with the matching database and predicting the polishing characteristics and life-span of the to-be-tested soft polishing pad subject to the comparison result. Subject to the aforesaid steps, the polishing characteristics and life-span of the to-be-tested soft polishing pad can be predicted without making an actual polishing test, thereby saving a large amount of time and cost.
申请公布号 US2011136407(A1) 申请公布日期 2011.06.09
申请号 US20100801555 申请日期 2010.06.15
申请人 NATIONAL CHUNG CHENG UNIVERSITY 发明人 JENG YEAU-REN;LIN YU-SHAUNG;HUANG PAY-YAU;LIN YU-JENG
分类号 B24B37/04 主分类号 B24B37/04
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