发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad.
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申请公布号 |
US2011133325(A1) |
申请公布日期 |
2011.06.09 |
申请号 |
US20090633789 |
申请日期 |
2009.12.08 |
申请人 |
MOON DONGSOO;LEE TAEWOO;PARK SOO-SAN;PARK SOOMOON;LEE SANG-HO |
发明人 |
MOON DONGSOO;LEE TAEWOO;PARK SOO-SAN;PARK SOOMOON;LEE SANG-HO |
分类号 |
H01L23/48;H01L21/50;H01L21/60;H01L23/485 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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