A probe card assembly can include a plurality of probes disposed on a substrate and arranged to contact terminals of a semiconductor wafer. Switches can be disposed on the probe card assembly and provide for selective connection and disconnection of the probes from electrical interconnections on the probe card assembly.
申请公布号
WO2011022301(A3)
申请公布日期
2011.06.09
申请号
WO2010US45441
申请日期
2010.08.13
申请人
FORMFACTOR, INC.;ARKIN, BRIAN;SPORCK, ALISTAIR NICHOLAS