Package using nanospring or microspring and method of fabricating the same

摘要

PURPOSE: A package using nano-spring or micro-spring and a method of fabricating the same are provided to electrically connect a chip and a substrate by using a nono or micro-spring instead of a conventional solder bump. CONSTITUTION: A pattern is formed on a substrate for a nano spring or a microspring. The nano spring or the microspring(30) is inclined against an evaporation source and be rotated to be formed on the pattern. The nano spring or microspring is transplanted on the chip pad of the wafer(70) in which the chip pad(60) is formed. The chip is diced according to the scribe line of a wafer and has the nano spring.