| 摘要 |
<p>The method for hardening an adhesive (3'), which is arranged on a first component (1') and a second component (2') to be adhered with the first component, by application of adhesive with a radiation (20), comprises influencing a part of the radiation directed in the direction of the adhesive in such a way that the part strikes on the selected area of the adhesive. The part of the radiation is blocked or diverted. A complete application of the adhesive with the radiation is carried out with a further irradiation process. The method for hardening an adhesive (3'), which is arranged on a first component (1') and on a second component (2') to be adhered with the first component, by application of adhesive with a radiation (20), comprises influencing a part of the radiation directed in the direction of the adhesive in such a way that the part strikes on the selected area of the adhesive. The part of the radiation is blocked or diverted. The ratio of the area and/or the surface on which the radiation is not striked on the basis of blockage or diversion on the available adhesive is selected to the area and/or the surface on which the radiation is striked on the available adhesive, in such a way that the adhesive volume not stopping the radiation is slightly greater than the shrink volume of the hardened adhesive. A complete application of the adhesive with the radiation is carried out with a further irradiation process. The adhesive is applied as layer between the components to be adhered, and a flat, radiopaque mask is used as means for partial blockage of the beam, where the mask is equipped with a radiation permeable area and is positioned between the radiation source and the component to be adhered. The radiation is UV-radiation and the adhesive is UV-curable adhesive. An independent claim is included for a microfluidic system.</p> |
