ULTRA-SILM CORELESS FLIP-CHIP CHIP SCALE PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A method manufacturing ultra thin coreless flip chip scale package is provided to easily manufacture the ultra thin printed circuit board by replacing a conventional printed circuit board material with a solder resist. CONSTITUTION: A printed circuit pattern(140) includes a solder ball pad area and a flip chip connection area at an upper part of a laminated carrier substrate. A solder resist pattern layer(150) is formed at an upper part of the printed circuit pattern. The laminated carrier substrate is removed. The solder resist pattern layer becomes a substrate supporting the printed circuit pattern. A surface processing layer(180) is formed on a surface of the printed circuit pattern exposed by the solder resist pattern layer.