| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve the miniaturization of a package size and the reduction of sealing resin in a packaging step. <P>SOLUTION: Each of a large number of die pads has an electrically conductive pattern which steps back inside from the edge of the die pad, where an electrically conductive pattern on a first die pad of the large number of die pads and an electrically conductive pattern on a second die pad of the large number of die pads are electrically connected by a junction formed between the first die pads and the second die pad, and, on the rear surface thereof, has an external electrode which is connected to the electrically conductive pattern and provided so as to step back from the edge of a region corresponding to the die pads, and the electrically conductive pattern is subjected to electroplating through the junction. <P>COPYRIGHT: (C)2008,JPO&INPIT |
