发明名称 BONDING METALS WITHOUT BRAZING ALLOYS
摘要 Excellent bonds between usually-brazed metals are obtained, without brazing or soldering alloys, by initially oxidizing the surfaces to be bonded and then bonding in a reducing atmosphere at a temperature below the melting point of either metal. If the metals form a eutectic, bonding will be carried out above the eutectic temperature. It is believed that the oxidation-reduction cycle produces a perfectly clean or nascent surface which facilitates bonding. Yields are improved by initially providing a very thin plated coating of silver, copper or nickel, or combinations thereof, on one workpiece.
申请公布号 US3667110(A) 申请公布日期 1972.06.06
申请号 USD3667110 申请日期 1969.11.03
申请人 CONTACTS INC. 发明人 CHILDRESS B. GWYN JR.
分类号 B21K1/58;B23K20/24;B23K35/00;H01H11/04;(IPC1-7):B23K31/02;B23K35/38 主分类号 B21K1/58
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