| 摘要 |
FIELD: chemistry. ^ SUBSTANCE: composition contains epoxy diane resin, oligoether acrylate, curing agent, initiator and solid filler. The filler is silica gel or aerosil. The initiator is in form of benzoin or dimethoxyphenyl acetophenone ethers. Oligoether acrylate is selected from a group of dimethacrylate ethers. The curing agent used is aliphatic or aromatic diamine and aliphatic or aromatic tertiary amine. The photocurable adhesive composition is obtained by mixing all components until their complete dissolution. The obtained mixture is put between glued surfaces and exposed to UV light for not less than 5 min. Further, thermal post-polymerisation is carried out at temperature not higher than 50C, followed by cooling and holding. The invention is used in production of organic light-emitting diodes to prolong their service life. ^ EFFECT: good adhesion to glass, weather resistance, low chemical aggressiveness, high water resistance and crack resistance when pressed between glass plates. ^ 8 cl, 3 tbl, 3 ex |
