| 摘要 |
<p>PURPOSE: A light emitting device, a light emitting device package, and a fabricating method thereof are provided to increase the light efficiency by reflecting the light generated in the light emitting device by forming a first lead electrode and a second lead electrode on a main body part. CONSTITUTION: An undoped semiconductor layer(120) is formed on a substrate(110). A first conductive semiconductor layer(130) is formed on the undoped semiconductor layer. An active layer(140) is formed on the first conductive semiconductor layer. A leakage current prevention layer(145) having the flat top is formed on the active layer.</p> |
