发明名称 |
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
摘要 |
An intermediate layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the intermediate layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.
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申请公布号 |
US7852634(B2) |
申请公布日期 |
2010.12.14 |
申请号 |
US20080034193 |
申请日期 |
2008.02.20 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
SAKAMOTO HAJIME;WANG DONGDONG |
分类号 |
H05K1/18;H05K3/46;H01L21/301;H01L21/60;H01L23/498;H01L23/538;H01R12/51 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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