Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers

摘要

A microelectronic device wafer includes an adhesive molded in-situ on the wafer. Adhesives and wafers are positioned in molds and a method that includes drawing in the molds at least a partial vacuum and partially curing the adhesive provides an in-situ molded adhesive that is positioned on the wafer. The adhesives can be in liquid, solid, or other forms prior to molding. During molding, the adhesive can be partially cured by heating or irradiating.