| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an aluminum bond pad with enhanced wire bond stability by preventing voids formed as an inter-metal compound is formed between a wire and a bond pad and atoms in the system are diffused when a gold wire is bonded to the aluminum bond pad in a thermal ultrasonic wave manner. <P>SOLUTION: An electronic device bond pad 140 includes an Al layer located over an electronic device substrate 120. The Al layer 210 contains intrinsic group 10 metal arranged therein. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
