发明名称 SEALING STRUCTURE AND THERMAL SHOCK DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a structure wherein a door for closing the low temperature space side is made lighten in weight and cryogenic leaks can be properly prevented, in a thermal shock device having a high-temperature vessel and a low-temperature vessel. SOLUTION: The structure includes a partition plate 8 provided so as to partition an opening part of the low temperature vessel 3 into a plurality of domains; a low-temperature vessel door 10 provided so that one (upper side domain 7u) of the plurality of partitioned domains 7u and 7b of the opening part can be opened/closed; a first packing 21 projected from the low-temperature vessel door 10 and capable of sticking to the partition plate 8 side; a second packing 22 projected from the partition plate 8 and capable of being stuck to the low-temperature vessel door 10 side; and a flexible film body 19. The structure is constituted so that the film body 19 is deformed elastically and is simultaneously brought into contact with the first packing 21 and the second packing 22 in the closed state of the low-temperature vessel door 10. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010276620(A) 申请公布日期 2010.12.09
申请号 JP20100205482 申请日期 2010.09.14
申请人 ESPEC CORP 发明人 FUJITA YOSHIHIRO
分类号 G01N3/60;G01N17/00 主分类号 G01N3/60
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