发明名称 LED Chip-Based Lighting Products And Methods Of Building
摘要 Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.
申请公布号 US2010308350(A1) 申请公布日期 2010.12.09
申请号 US20100857472 申请日期 2010.08.16
申请人 发明人 BISBERG JEFFREY
分类号 H01L33/58;H01L33/00 主分类号 H01L33/58
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