发明名称 LEAD WIRE CONNECTION APPARATUS AND CONNECTION METHOD
摘要 A lead wire connection apparatus is provided with: a conveyer (6) to transport a substrate with one face thereof up, the one face having cells formed thereon; lead wire supply units (11 to 13) arranged sideward in a direction intersecting a transport direction of the substrate positioned by the conveyer for the transport; a feeding chuck (27) to extract lead wire from the lead wire supply units along the direction intersecting the transport direction of the substrate; a tape attaching means (31) to attach, on a lower face of the lead wire extracted from the lead wire supply units, a plurality of tape pieces (28a) obtained by cutting conductive tape (28) made of an adhesive thermosetting resin into pieces of a predetermined length, the lower face facing the upper face of the substrate; and a pressurizing tool (61) to, when the lead wire having the tape pieces attached thereon by the tape attaching means is extracted above the substrate by the feeding chuck in the direction intersecting the transport direction of the substrate, connect the lead wire to the cells with the tape pieces therebetween by pressurizing and heating parts of the upper faces of the lead wire, the parts having the tape pieces attached thereon.
申请公布号 WO2010140467(A1) 申请公布日期 2010.12.09
申请号 WO2010JP58311 申请日期 2010.05.17
申请人 SHIBAURA MECHATRONICS CORPORATION;MINAMIHAMA, ETSUO;SUGINUMA, HISASHI;MORI, HARUO;OKAZAWA, MITSUHIRO 发明人 MINAMIHAMA, ETSUO;SUGINUMA, HISASHI;MORI, HARUO;OKAZAWA, MITSUHIRO
分类号 H01L31/042 主分类号 H01L31/042
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