LED PACKAGE MODULE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A light emitting diode package module and a manufacturing method thereof are provided to improve heat radiation and luminous efficiency by using heat radiation fins with various structures and reflectors. CONSTITUTION: A plurality of insertion holes are formed on a printed circuit board(100). A circuit pattern including an electrode pattern is formed on the printed circuit board. A plurality of heat radiation fins(200) are inserted and fixed to the plurality of insertion holes. A plurality of light emitting diode chips(510) are mounted on the part of the printed circuit board which includes the part of the plurality of heat radiation fins.