| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring motherboard wherein predetermined different plating layers are successfully stuck to exposed surfaces of a plurality of conductors within a wiring motherboard region. <P>SOLUTION: The wiring motherboard includes a motherboard 1 formed by laminating a plurality of insulating layers 1, a wiring board region 1a arranged at a center part of the motherboard 1, a dummy region 1b provided at a periphery of the wiring board region 1a, a first conductor 2a and a second conductor 2b provided in the wiring board region 1a, a frame-shaped first plating conductor 3a arranged on a dummy region 1b of one insulating layer and electrically connected to the first conductor 2a, and a frame-shaped second plating conductor 3b arranged on a dummy region 1b of an insulating layer different from the insulating layer 3b where the first plating conductor 3a is arranged without overlapping the first plating conductor 3a in plan view, and not electrically connected to the first plating conductor 3a, but electrically connected to the second conductor 2b. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
