发明名称 CONNECTION METHOD AND CONNECTION DEVICE OF ELECTRIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a connecting device capable of electric connection of electric components without using solder, since the solder is an alloy with lead and tin as main ingredients whose use tends to be forbidden, although many of the electric components are mounted by soldering. <P>SOLUTION: A plasma generating device is provided for generating surface wave plasma in a reducing atmosphere of hydrogen gas by supplying hydrogen gas together with microwave power in a treatment room. After an electric connection terminal 22 with oxide films 24, 25 formed and a printed circuit 23a are jointed to have a connector 20 arranged on a printed circuit board 23, the printed circuit board 23 is housed in the treatment room to be exposed to the surface wave plasma, and then, the above oxide films 24, 25 and stains are reduced to have the electric connecting terminal 22 connected to the printed circuit 23a, and the connector 20 is mounted on the printed circuit board 23. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010277754(A) 申请公布日期 2010.12.09
申请号 JP20090127383 申请日期 2009.05.27
申请人 MICRO DENSHI KK 发明人 TAKIZAWA TSUTOMU
分类号 H01R43/02;B23K20/00;B23K20/24;B23K101/42;H05K3/32 主分类号 H01R43/02
代理机构 代理人
主权项
地址