| 摘要 |
PROBLEM TO BE SOLVED: To prevent a substrate from being deformed or cracked in the film due to stress of a burnt film, when the substrate is placed on a support stand, and the film on the substrate is burnt so as to form the film by not heating the substrate from the support stand but spraying gas of a high temperature from the substrate. SOLUTION: Burning heat treatment for spraying gas of the high temperature with a fixed heat amount from the support stand of the substrate and for spraying gas with not less than the fixed heat amount is performed. A difference of the heat amount is given by a gas temperature, a gas flow rate, moving speed of the substrate, and a difference between the substrate, and a gas spraying device. Heat burning treatment can also be performed on a bendable sheet-like resin substrate. COPYRIGHT: (C)2011,JPO&INPIT
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