发明名称 BONDING DEVICE, AND METHOD OF CORRECTING OFFSET AMOUNT OF BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To achieve excellent bonding in an easy method even if the optical axis of a camera is inclined. SOLUTION: An offset amount is corrected based upon the difference between a first shift amount and a second shift amount and an amount of Z-directional movement of a reference member by: acquiring a first image of a bonding tool and the reference member by moving the bonding head by the offset amount in a minus X direction after adjusting the position of the bonding head so that the reference member is in the center of a visual field; acquiring the first shift amount from the image; acquiring a second image of the bonding tool and reference member by moving the bonding head by the offset amount in the minus X direction after elevating the reference member and then moving the bonding head in a plus X direction so that the reference member is in the center of the visual field; and acquiring the second shift amount between the bonding tool and reference member in a first direction from the second image. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278128(A) 申请公布日期 2010.12.09
申请号 JP20090127683 申请日期 2009.05.27
申请人 SHINKAWA LTD 发明人 YUZAWA HIROYA;HAYATA SHIGERU
分类号 H01L21/60 主分类号 H01L21/60
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