| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal decomposition device in regard to a device carrying out thermal decomposition by flame of harmful components included in exhaust gas discharged from a semiconductor manufacturing process, capable of efficiently decomposing the target harmful components even if the exhaust gas includes high concentration corrosive gas or if high concentration corrosive gas is generated by thermal decomposition by flame, and wherein a configuration of a combustion chamber has superior corrosion resistance with respect to high temperature corrosive gas. SOLUTION: The thermal decomposition device includes the combustion chamber carrying out thermal decomposition of harmful components, a nozzle jetting out gas including fuel gas and air to the combustion chamber, and a nozzle jetting out gas including exhaust gas to the combustion chamber. The device is comprised by composing a side wall of the combustion chamber by a base material covered with fluororesin on a surface of a combustion chamber side, and providing a passage for circulating a refrigerant throughout a whole outer circumference of the side wall. COPYRIGHT: (C)2011,JPO&INPIT |
