| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition superior in surface flatness after solder resist formation and used for a dry film type photosensitive solder resist which satisfies soldering heat resistance, gold plating resistance, insulation reliability and cracking resistance and shows excellent stability, and to provide a photosensitive element using the same. <P>SOLUTION: The photosensitive resin composition comprises (a) a photosensitive prepolymer prepared by reacting a reaction product of a polyfunctional epoxy resin and an ester compound of an unsaturated monocarboxylic acid or an ester compound of a saturated or unsaturated polybasic acid with a saturated or unsaturated polybasic acid anhydride and further adding a compound having one glycidyl group and at least one ethylenically unsaturated group per molecule, (b) a photopolymerizable monomer having at least one ethylenically unsaturated group per molecule, (c) a photopolymerization initiator, and (d) a blocked isocyanate. <P>COPYRIGHT: (C)2011,JPO&INPIT |
