发明名称 High-density electrical interconnect system
摘要 An electrical connector includes a projection-type interconnect component and a receiving type interconnect component. The projection-type interconnect component includes an insulative buttress and a plurality of electrically conductive contacts. The contacts are spaced from each other around a circumference of the insulative buttress. The receiving-type interconnect component is adapted for receiving the projection-type interconnect component. The receiving-type interconnect component includes a plurality of flexible, electrically conductive contacts and a spacer movable relative to the flexible contacts. The spacer at least partially flexes the flexible contacts when the spacer is in a first position. The insulative buttress of the projection-type interconnect component displaces the spacer of the receiving-type interconnect component when the projection-type interconnect component is received by the receiving-type interconnect component.
申请公布号 US6203347(B1) 申请公布日期 2001.03.20
申请号 US19990407955 申请日期 1999.09.28
申请人 SILICON BANDWIDTH INC. 发明人 CRANE, JR. STANFORD W.
分类号 H01R13/11;H01R4/24;H01R12/16;H01R12/22;H01R13/02;H01R13/03;H01R13/04;H01R13/193;H01R13/26;H01R24/00;H01R24/02;H05K1/00;(IPC1-7):H01R11/22 主分类号 H01R13/11
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