| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting machine capable of transferring flux without reference to whether an electronic component is large or small, and to provide a flux transfer device thereof. <P>SOLUTION: When fthe lux F on a film member 18 is elevated by a press part 10 from an opening end of a flux tank 14 to outside and the electronic component W is lowered, the flux on the film member is transferred to a bump W1 of the electronic component. While a transfer region of the electronic component is divided, the flux is transferred in order to coat all bumps of the electronic component with the flux without reference to whether the electronic component is large or small, so the need for new flux tanks (or new electronic component mounting machines) corresponding to respective electronic components is eliminated. Similarly, while the transfer region of the electronic component is divided, the flux can be transferred in order, so the adhesive strength of the flux to the electronic component becomes weak. Namely, a large electronic component can be held only with sucking force of a suction nozzle 29, so no special holding means is necessary. <P>COPYRIGHT: (C)2011,JPO&INPIT |
