| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that secures a creepage distance between electrodes and can be made compact.SOLUTION: A semiconductor element 12, a plurality of metal plates 13, 14 connected to the semiconductor element 12, and a plurality of terminal parts 23, 24 connected to the metal plates 13, 14 are sealed with a sealing part 15 so that parts of the metal plates 13, 14 and parts of the terminal parts 23, 24 are exposed respectively, and a part on a base end side as a side of the sealing part 15 between the parts of the terminal parts 23, 24 which protrude to be exposed from the sealing part 15 is coated with an insulator 25. |
