| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide carrier tape paper for a chip-like electronic component, the carrier tape paper being designed so as to prevent beard-like projections and/or nap from being formed on the internal wall of a square hole, also prevent dust from arising during attachment/conveyance, and be usable in a clean room. <P>SOLUTION: In the carrier tape paper for a chip-like electronic component, multi-layer paper board formed as base paper comprises surface, intermediate and back layers having N-BKP and L-BKP as their main constituents. The multi-layer paper board has a thickness of 1.10 mm or less, contains 0.3 to 3.0 mass% of amphoteric starch based on 100 mass% of pulp solid content, and contains no sizing agent. In addition, using an on-machine size press, a water dispersion emulsion binder is externally added to the multi-layer paper board to the depth of 30μm or greater from the paper surface. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
