| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity and generating no residue on a pattern, a method for producing a cured relief pattern and a semiconductor device. <P>SOLUTION: The photosensitive resin composition for alkali development includes (a) 100 pts.mass of a polyamic acid, (b) 1-100 pts.mass of a compound represented by formula (1), and (c) 1-50 pts.mass of a photosensitizer, wherein R<SP>1</SP>and R<SP>2</SP>each independently represent H or a 1-10C organic group, provided that at least one of R<SP>1</SP>and R<SP>2</SP>is a ≥6C organic group; and R<SP>3</SP>represents a ≥1C organic group. <P>COPYRIGHT: (C)2011,JPO&INPIT |
