发明名称 Method of making nitride semiconductor laser, method of making epitaxial wafer, and nitride semiconductor laser
摘要 A method of making a nitride semiconductor laser comprises forming a first InGaN film for an active layer on a gallium nitride based semiconductor region, and the first InGaN film has a first thickness. In the formation of the first InGaN film, a first gallium raw material, a first indium raw material, and a first nitrogen raw material are supplied to a reactor to deposit a first InGaN for forming the first InGaN film at a first temperature, and the first InGaN has a thickness thinner than the first thickness. Next, the first InGaN is heat-treated at a second temperature lower than the first temperature in the reactor, while supplying a second indium raw material and a second nitrogen raw material to the reactor. Then, after the heat treatment, a second InGaN is deposited at least once to form the first InGaN film.
申请公布号 US7883915(B2) 申请公布日期 2011.02.08
申请号 US20090429322 申请日期 2009.04.24
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 UENO MASAKI;KYONO TAKASHI
分类号 H01L21/00;H01S5/343 主分类号 H01L21/00
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