ANISOTROPIC CONDUCTIVE ADHESIVE AND CONNECTION METHOD BETWEEN TERMINALS USING THE SAME

摘要

PURPOSE: An anisotropic conductive adhesive and a connection method between terminals using the same are provided to flexibly cope with physical and mechanical loads and thermal load by forming a conductive pathway in a liquid form within an operation temperature range of micro parts and chip parts. CONSTITUTION: An anisotropic conductive adhesive(300) comprises conductive particles(301) with a melting point of 20-70 °C and polymers(302) with a hardening temperature higher than a melting point of the conductive particles. A connection method between terminals comprises the steps of: arranging the anisotropic conductive adhesive between a first substrate(100) in which first wetting regions(101) are formed and a second substrate(200) in which second wetting regions(201) are formed; and electrically connecting the first wetting regions and the second wetting regions by forming a conductive layer(301) on the surface of the wetting regions through the heating of the anisotropic conductive adhesive to a temperature where the curing of the polymer is not completed.