| 摘要 |
PROBLEM TO BE SOLVED: To prevent a transfer portion formed on a substrate from becoming smaller than an amount of solder paste filled into a through window to form a shape of the through window, in the case that, as to the solder paste filled into the through window of a mask, the solder paste making contact with the through window adheres to the through window to remain in the through window when removing the mask. SOLUTION: In an ultrasonic transmission step (S105), ultrasonic vibration is transmitted to the mask 5 and the paste 4 filled into the through window 6 so that adhesion between the paste 4 filled into the through window 6 and the through window 6 is weakened, thus, in a mask removal step (S106), the paste 4 is easily removed from the through window 6, thus suppressing the paste 4 from remaining in the through window 6, forming the transfer portion 2 including the paste 4 on the substrate 3. This is more effective, in particular, when forming the transfer portion on the substrate 3 so that the transfer portion 2 is minutely thickened, that is, an aspect ratio (H/W) of a thickness H and a width W of the transfer portion 2 is enlarged. COPYRIGHT: (C)2011,JPO&INPIT
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