| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip module that is cost-effective and suits for the integration with a multi-chip module process.SOLUTION: A first semiconductor chip 40 is mounted and wirebonded to a support substrate 12. A second semiconductor chip 64 is pressed into a support material 60 squeezing the support material 60 into a region adjacent a spacer 50 and between the first 40 and second 64 semiconductor chips. Alternatively, the support material 60 is disposed on the first semiconductor chip 40 and a die attach material 62 is disposed on the spacer 50. The second semiconductor chip 64 is pressed into the die attach material 62 and the support material 60, squeezing a portion of the support material 60 over the spacer edges 53, 55. Wirebonds are formed between the support substrate 12 and the first 40 and second 64 semiconductor chips. |
