发明名称 |
HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-radiating substrate capable of protecting a thermally weakened element from the heat generated from a heat generating element, while maintaining heat-radiating characteristics, and a method of manufacturing the same. <P>SOLUTION: The heat-radiating substrate includes a core layer 110 including a core metal layer 111 and a core insulating layer 112 formed on the core metal layer 111 and divided into a first region and a second region; a circuit layer 120 formed in the first region of the core layer 110; and a build-up layer 130 formed in the second region of the core layer 110 and including a build-up insulating layer 131 and a build-up circuit layer 132. A heat generating element 150 is mounted on the circuit layer 120 and a thermally weakened element 151 is mounted on the build-up layer 130, thereby preventing the thermally weakened element 151 from being damaged by the heat generated from the heat generating element 150. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012004527(A) |
申请公布日期 |
2012.01.05 |
申请号 |
JP20100235251 |
申请日期 |
2010.10.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
LIM CHAN-HYUN;KANG JUNG-UN;CHOI SYONG MUN;KIM KYAN-SOO;CHAE JUN-SEOK;PARK JON-KYUN |
分类号 |
H05K1/05;H05K1/18;H05K3/46 |
主分类号 |
H05K1/05 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|