LIGHT EMITTING ELEMENT PACKAGE, METHOD FOR MANUFACTURING THE SAME, LIGHT EMITTING ELEMENT ARRAY, AND DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a light emitting element package which reduces the influence of external force on a sealing resin and in which a light emitting element is sealed with a double structure sealing resin.

SOLUTION: An LED package 10 includes a first sealing resin 5 sealing an LED chip 4 mounted on a substrate 1 and a second sealing resin 6 covering the first sealing resin 5. Adhesion strength A between the first sealing resin 5 and the second sealing resin 6 is smaller than adhesion strength B between the second sealing resin 6 and the substrate 1.

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